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Unique technologies and processes: grinding, polishing, laser cutting technology process unique, flexible lossless processing, does not affect the internal quality PCD layer.
Machining high precision, strict tolerance: diameter: ± 0.03mm Thickness: ± 0.1 mm diamond layer thickness: ± 0.02 mm diamond chamfering: ± 0.08 × 45 ° (mm) carbide chamfer: ± 0.08 × 45 ° (mm )
Scientific and strict quality control system to ensure that the whole process quality with a rich variety of detection methods, with scanning electron microscopy, high-precision ultrasonic nondestructive testing instrument, such as high-end devices can detect the degree of PCD layer and a solid layer of carbide layers combined, PCD internal crystal the structure, stress patterns and PCD layer thickness to avoid processing blindness
Machining high precision, strict tolerance: diameter: ± 0.03mm Thickness: ± 0.1 mm diamond layer thickness: ± 0.02 mm diamond chamfering: ± 0.08 × 45 ° (mm) carbide chamfer: ± 0.08 × 45 ° (mm )
Scientific and strict quality control system to ensure that the whole process quality with a rich variety of detection methods, with scanning electron microscopy, high-precision ultrasonic nondestructive testing instrument, such as high-end devices can detect the degree of PCD layer and a solid layer of carbide layers combined, PCD internal crystal the structure, stress patterns and PCD layer thickness to avoid processing blindness
